Keynote Speakers/大会报告 | |
![]() | Prof. Jun Xu, Xi’an Jiaotong University, China(IEEE Senior Member/Dean) 徐俊,教授,西安交通大学 Jun Xu is currently a professor and a Ph.D. supervisor with School of Mechanical Engineering, Xi'an Jiaotong University.He is the director of the Digital Energy Research Institute of GRESGYING & XJTU, and the director of the Energy Storage and Inverter Institute of ADUC & XJTU.He serves as IEEE Senior Member, the Vice Chairman of Shaanxi Power Supply Society, and the Chairman of Youth Working Committee of SAE-Shaanxi. His research interests include design, modeling, and control of battery systems, electric vehicles, renewable energy systems, and robots.Dr. Xu has been the Principal Investigator of more than 30 research grants. Dr. Xu has published more than 100 peer-reviewed papers, including 5 ESI highly cited paper. He has delivered Plenary/keynote/invited presentations more than 10 times in academic conferences. Dr. Xu has received 4 research awards, including the 2nd Prize of Shaanxi Province Teaching Achievement Award. |
Prof. Dongfang Wang, Jilin University, China 王东方,教授,吉林大学 Dong F. Wang (Tang Aoqing Professor) received the B.E. and M.E. degrees in materials science and engineering from Zhejiang University, Hangzhou, China, and the Ph.D. degree in mechatronic and precision engineering from Tohoku University, Sendai, Japan.He was with Prof. Masayoshi Esashi with the Micro-Electro-Mechanical Systems (MEMS) Laboratory, Tohoku University, where his research was focused on nanomachining of ultrathin hard films, nanomechanics of ultrathin silicon resonators, and micro/nanomagnetic mesa structures for all-silicon quantum computers. Since 2014, he has been a Leading Professor/Head with the Micro Engineering and Micro Systems (MEMS) Laboratory (JML), Jilin University, Changchun, China. He has authored three international book chapters in Micro-Electro-Mechanical Systems (Springer, 2018) and Advanced Sensors and Sensing Technologies for Electric Vehicles (AIP, 2022) and more than 220 peer-reviewed articles in international journals, including Elsevier Mechanical Systems and Signal Processing (MSSP), IEEE Transactions on Industrial Electronics (TIE), IEEE Transactions on Instrumentation and Measurement (TIM), and AIP Applied Physics Letters (APL), and conference proceedings. His representative achievement of “resonant current sensor” has been labeled as “resonant galvanometer or Wang’s galvanometer” by Elsevier Measurement, TIE, TIM etc. since 2022. He holds 70 Chinese patents and two Japanese patents. He has given more than 20 invited presentations at universities/institutes and more than 10 keynote/plenary addresses at international conferences. His research interests include Micro-Electro-Mechanical Systems / Nano-Electro-Mechanical Systems (MEMS/NEMS), resonant physical sensors (RPSs), as well as smart sensing for intelligent machinery (SSIM).Dr. Wang serves as the Evaluation Expert for National Natural Science Foundation of China (NSFC), Ministry of Science and Technology of the People’s Republic of China, and Ministry of Education of the People’s Republic of China.Dr. Wang is a Senior Member of Chinese Mechanical Engineering Society (CMES) and Chinese Society of Micro-Nano Technology (CSMNT) and a member of Institute of Electrical and Electronic Engineers (IEEE) (USA), Japanese Society of Mechanical Engineers (JSME) (Japan), Institute of Electrical Engineers of Japan (IEEJ) (Japan), the Japan Society of Next Generation Sensor Technology, and the MEMS Industry Forum (Japan). He has received several awards from Japan, USA, and China. He serves as the General Chair and the Co-Chairperson for more than 10 international conferences and a contributing reviewer for more than 40 SCI-indexed journals. He has been one of the founders of the Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS) since 2006 as well as the Japan–China–Korea Joint Conference on MEMS/NEMS (JCK MEMS/NEMS) dated back to 2006. His group is also collaborating with professors/researchers from Tohoku University, The University of Tokyo, and the National Institute of Advanced Industrial Science and Technology in ubiquitous MEMS and micro engineering. |
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